首届亚太半导体峰会暨博览会（APSSE 2024）将于2024年10月16日-18日在马来西亚槟城举行。
2024年APSSE以“汇聚槟城，芯动亚太”为主题，邀请集成电路行业领军人物、专家学者、企业家、半导体协会及高校等产业精英汇聚槟城，共同展望半导体产业的未来发展趋势，共话产业的创新与合作。
大会将进行主题报告、圆桌讨论、技术交流、商贸配对等活动，围绕集成电路及半导体器件产业、TFT面板产业、光伏及储能产业、LED技术等议题展开。
大会议程
APSSE 2024 Agenda
Day 1: 16 Oct. 2024
2024年10月16日
08:00 – 08:55 Registration
Opening Ceremony
09:00~09:10
Welcoming Ceremony
09:15~09:25
DSW, President of MSIA
09:30~09:40
YAB, Chief Minister of Penang
09:45~09:50
Opening Launching
09:55~10:30
Tea Break
Plenary Session: Global Semiconductor Growth
10:30~11:30
Topic 1: Global Semiconductor Outlook
The Semiconductor Surge: A Global Perspective on the Industry’s Evolution and Pathways
Keynote Speech by David Wang
Moderator:
Andrew Chan Secretary General, MSIA
Dato Seri Wong, President, MSIA
Dr. David Wang, Chairman, ACM Research Inc
Nancy Greco, Global Distribution Sales Leader, IBM
Shivaji Das, Managing Director, APAC & Partner, Frost & Sullivan
Dr. Yeong Che Fai, CEO, DF Automation & Robotics Sdn Bhd
Representative, TONGFU
11:30~12:30
Topic 2: Transitioning from Local to International Outbound Investments
From Local Roots to Global Giants: Navigating the Complexities of International Investment Expansion
Moderator:CJ Li,Executive Vice General Manager, Hanglingwei(Taizhou)Technology Co., Ltd
Dato’ Loo Lee Lian, CEO, Invest Penang
Kevin Khoo, Group COO, UNISEM Berhad
John Lai Vice President, Carsem Semiconductor (Suzhou) Co., Ltd (Tentative)
Yap Chi Hui, Chairman of MAYCHAM Shanghai Branch
Tan Wei Xian, Partner, Skrine & Co.
12:30~14:00
Lunch Break
Plenary Session: Sustainability & ESG
14:30~16:00
Topic 3: Advancing ESG through Innovations
Could Businesses Collaboration Drive Innovations in ESG Sustainability?
Keynote Speech by Mr Ma Weihua
Moderator:
Kok Chew Chin Director, CIMB
Sachin Gupta, APAC Sustainability Leader, IBM
Dato Png Soo Hong，Cradle Fund
Ma Weihua Chairman, National Fund for Technology Transfer & Commercialization & Member of UNDP SDG lmpact Steering
Arina Kok, CCASS Leader, EY Malaysia
Plenary Session: Sustainability & ESG
16:00~17:00
Topic 4: Asia Pacific Semiconductor Strategies
Unleashing Potential: How Asia Pacific is Shaping the Future of Semiconductor Innovation
Moderator:
Andrew Chan Secretary General, MSIA
Dato' KL Bock, Vice President, Western Digital
Dato WK Foong, Managing Director, JF Technology Berhad
Ang Wee Seng, Chairman, Singapore Semiconductor Industry Association (SSIA)
Danny Chan, Director of TMT Sector, CIMB
Desmond Hor, Deputy General Manager, Jiangsu Leadlap Semiconductor Technology Co., Ltd
17:00~19:00
Cocktail Networking
19:00~22:00
Gala Dinner
Day 2: 17 Oct. 2024
2024年10月17日
08:00 – 08:55 Registration
Technical Track: Smart Initiatives
09:00~10:15
Topic 5: Artificial Intelligence
AI's Transformative Power: How Artificial Intelligence is Set to Revolutionize Our Lives
Moderator:
Jack Xu CEO, Soterea Technology Ltd
Gavin Ni, Vice President,Cloud Business Development, Huawei
Dr. Eric Chiang, GM, Baidu Paddle Strategic Investment Center & Adjunct Professor, Hong Kong City University
Dr. James Ong Founder, Artificial Intelligence International Institute
Matthias Meienhofer, CPE Partner Sales Manager, DS Singapore
See Chin Liang, Director of software Engineering
StarFive Technology Int. Sdn Bhd.
Representative IBM
10:20~10.45
Tea Break
10:45~12:00
Topic 6: Intellectual Property
How to Remain Tomorrow’s Sustainability with Yesterday’s IP Technology?
Moderator:
Kok Chew Chin Director, CIMB
Andy Goh, Vice President, JF Technology Berhad
Pauline Khor, Partner, Rahmat Lim & Partners
Patricia Chung, Founder, Chung Chambers
Cecilia Lou, Partner, King&Wood China & Hong Kong
12:00~13:30
Lunch Break
Technical Track: Semiconductor Development
14:00~15:00
Topic 7: Advanced Packaging
The Next Frontier in Semiconductor Packaging: Exploring the Innovations Shaping Technologies
Moderator:
Dr Eu of NXP Group
Dr. E. Jan Vardaman, President, TechSearch. Inc.
Dr. YY Tan, Senior Technology & Market Analyst, YOLE Group
Dr. Linus Lau, Director, RF Station Sdn Bhd
Zhaowei Jia, Vice President, ACM Research (Shanghai)
Lincoln Lee, PAC RIM VICE PRESIDENT Technical AE, SIEMENS EDA
15:00~15:15
Tea Break
15:15 – 16:30
Topic 8 Strategies for STEM Talent Development
Empowering Tomorrow's Innovators: Strategic Approaches to Cultivate the Next Generation of STEM Talent
Moderator:
Andrew Chan Secretary General, MSIA
Dr. Koay, Academic Head, Vitrox College
SK Fong, CEO, SkyeChip
Low Choy Huat, Partner, EY Malaysia
Sara Lau Partner, Skrine & Co
Louis Looi Managing Director, Fairwork Malaysia (Tentative)
Baddie Abdullah, Principal(Talent), TalentCorp Malaysia Bhd
Upstream & Downstream Business Matchmaking
10:00~17:00
Business Matchmaking Session
*议程持续更新中，请以现场实际为准
APSSE 2024 部分参会企业名单
▲上下滑动
Kintetsu World Express Malaysia Sdn. Bhd.
KWE
PepperHi
NICHIAS Southeast Asia Sdn. Bhd.
Hitachi High Tech
ASTRI Hong Kong
Silitech Technology
AaltoSemi Inc
GCC Cleanroom Construction Company
STATS ChipPAC Pte. Ltd.
Singaporean-German Chamber of Industry and Commerce
PENTAMETALS System SDN BHD
HYC Singapore
HYC
Alconix Castle Metals And Chemicals Sdn Bhd
AVK Singapore Pte Limited
Engie Services Malaysia Sdn Bhd
Balance gaming network
ITOCHU Malaysia Snd. Bhd.
TNG Digital
MSKD TECHNOLOGIES SDN BHD
Axen alpha advisory sdn bhd
Shan Poornam Metals Sdn. Bhd.
Eltete Malaysia Sdn Bhd
Admiral Testing Services (M) Sdn Bhd
Solar Energy Research Institute (SERI)
Asia Partners
RC Precision Engineering Sdn Bhd
AtkinsRealis Malaysia
Inventec Performance Chemicals S.E.A. Sdn Bhd
FAGOR AUTOMATION
Electronic component distributor
Techno Horizon Co., Ltd
AnalogueSmith (S) Pte. Ltd.
AccoTEST Technology (M) Sdn Bhd
ADTEC Taiping
Control Automation Technology Sdn Bhd
Control Automation Technology Sdn Bhd
elliance sdn bhd
Accenture
DDMan Sdn Bhd
W Capstone
Purchasing
Rockwell Automation
Micron Memory Penang
DF Automation & Robotics Sdn Bhd
Pilz Malaysia
Honeywell
PowerTech Bhd Snd
Samtec
DENSO International Asia
Tech Mahindra ICT Services (Malaysia) Sdn Bhd
Ram lifting technologies pte ltd
DENSO (MALAYSIA) SDN. BHD.
Biz. Integration Department
Greatech Integration
Developer
Kardex Malaysia Sdn Bhd
Venture Electronics Sdn Bhd
Inventec Performance Chemicals SEA SDN BHD
Roland Berger
USAINS Holding Sdn. Bhd.
ESCATEC Sdn Bhd
Star Capital
MSKD TECHNOLOGIES SDN BHD
DKSH TECHNOLOGY SDN BHD
UST
Accretech (malaysia) sdn bhd
China International Capital Corp
SF Global Express (M) Sdn Bhd
NEFAB Southeast Asia
Siemens Malaysia Sdn Bhd
T.R. Hamzah & Yeang Sdn Bhd
Nefab (Malaysia) Sdn Bhd
Advantest
ECOXCEL ADVISORY SDN BHD
Stratus Automation Sdn Bhd
Electro Rent
KONTRON ASIA PACIFIC DESIGN SDN BHD
GCI Science&Technology(M) SDN.BHD
Roncelli Plastics Sdn Bhd
BioEnergy Project Sdn Bhd
Brooks Instrument Malaysia
JHM Consolidation Berhad
FSBM MES ELITE SDN BHD
MXP TEST SDN BHD
QES Vision Solutions
Indium Corporation
Progressture Power Sdn Bhd
MXPAC SDN. BHD.
MSIA
MOSTI
MITI
Economy
MOF
MOHR
MIDA
Matrade
MPC
SME Corp
Talent Corp
BNM
NCER
Khazanah
MBSP
MBPP
InvestPenang
PDC
PSDC
SEMI
SAMENTA
FMM
MEIF
SSIA
PEMUDAH
Consulate General of China
CEPEA
LHDN
MIMOS
Academy Sains Malaysia
Malaysian Industrial Development Finance Berhad (MIDF)
Malaysian Technology Development Corporation (MTDC)
SFAM
MIMOS/MICDA
Bursa Malaysia
M. Foreign Affairs
Penang State
EPU / MEA
NCIA
MIDA Penang
Matrade Penang
BNM Penang
SME Corp Penang
Customs Penang
MITI Penang
TalentCorp
PCEB
湖州中锐洁净科技有限公司
Huzhou Zhongrui Cleaning Technology Co.,Ltd
上海亚螺精密紧固技术有限公司
上海集迦电子科技有限公司
BETTER PURO CO., LTD
西安和其光电
Herch Opto Electronic Technology Co. Ltd.
西安和其光电科技股份有限公司
MRT SOLUTIONS SDN BHD
BICCNS
Electronic component distributor
OMEGA Scientific Taiwan LTD.
Howards Technology Malaysia SDN.BHD.
Suzhou Jettek Electronics Technology Co.,Ltd.
博裕万物资本
中国电子系统工程第二建设有限公司
北京达越科技有限公司
上海大族富创得科技股份有限公司
上海颢文科技设备有限公司
SUZHOU MERIT AIRCRAFT & AEROSPACE MATERIAL CO.,LTD
SMIF Automation SDN BHD
University of Macau/Huawei-Hisilicon Tech Co. Ltd
FINE ENGINEERING TECHNOLOGY SDN. BHD.
BOTH ENGINEERING CO.,LTD
华为技术有限公司
建信信托有限责任公司
CCB TRUST Co. Ltd.
砂时精微
Novachiptech
ZHEJIANG DONGKAI SEMICONDUCTOR SCIENCE & TECHNOLOGY CO., LTD.
Ruijie Networks
Marketech International Sdn. Bhd.
CASH REALTY SDN. BHD.
Cash Realty Sdn Bhd
SUZHOU DLC TECHNOLOGY CO.,LTD
无锡恒大电子科技有限公司
清能德创
Primarius Technologies Co.,Ltd
深圳华业天成投资有限公司
上海同协科工贸有限公司
滁州市龙祥电子科技有限公司
Integrated Service Technology Inc.
HARPER WIRA SDN BHD
MRT Solutions Sdn Bhd
ATX Semiconductor
Alliance Power & Energy Group
Honeywell International Inc.
PepperHi
ASTRI Hong Kong
STATS ChipPAC Pte. Ltd.
Marketing
Stratus Automation Sdn. Bhd.
Alpha X Technology
Techno Horizon
SICC
Maps and Globe Specialist
kiranbhagotra.com (incl protectbox.com)
DerTran
MM CENTURY SDN. BHD.
PT. Filtrindo
MM Century Sdn. Bhd.
Micorn Memory Penang
Samtec
SH.Tech
Apex GPO Sdn Bhd
Spring Semiconductor
MTSC Solution Sdn. Bhd
2024 亚太半导体峰会暨博览会(APSSE)
The 2024 Asia-Pacific Semiconductor Summit and Expo
遵循“合作、共赢”的宗旨，APSSE努力构建一座聚“芯”汇力、链接全球、共谋发展的桥梁。值中马建交50周年之际，APSSE以更积极主动、高效协同的角色助力企业融入全球半导体产业生态。首届亚太半导体峰会暨博览会（APSSE 2024）透过槟城举足轻重的全球产业地位，帮助更多半导体产业企业更好地链接全球产业资源。
大会将安排“展览展示+论坛演讲+商务考察”，参会/参展企业通过APSSE平台能够充分展示和获取行业新技术、新产品、新景象，与亚太地区乃至全球的同行们建立更紧密的联系与良好的互动。
